underfill LOCTITE UF3808 ECCOBOND UF3808 UF3810

LOCTITE ECCOBOND UF3808 capillary underfill is designed to cure quickly at low ECCOBOND UF3810 LOCTITE UF3808

temperatures to minimize stress to other components. When

cured, this material provides excellent mechanical properties to

protect solder joints during thermal cycling.

TYPICAL PROPERTIES OF UNCURED MATERIAL UF3838T

Viscosity @ 20 s-1 , Cone and Plate, mPa?s (cP) 360

Specific, 1.16

Pot life @ 25 °C, 25% viscosity increase, days 3

Shelf Life @ -20°C, months 6

Flash Point - See MSDS

LOCTITE ECCOBOND UF3820 UF2801 UF3840